Micron Targets 2028 vHBM Production With Next-Gen AI Memory Design Facing Heat Challenges

According to Benzinga, Micron Technology unveiled its next-generation vertical high-bandwidth memory (vHBM) technology roadmap at a recent technical conference, targeting production to begin in 2028 with three product generations planned by 2030. The new architecture stacks DRAM directly on top of processors, shortening data transmission distances and boosting bandwidth for AI inference workloads.

However, the design faces a significant heat dissipation challenge. Analysts note that placing memory directly above processors impedes heat removal, potentially limiting application scope. Micron expects vHBM to coexist with traditional HBM rather than replace it entirely, as different systems will require varying solutions balancing bandwidth needs, thermal constraints, and packaging complexity.