2026-11-13 15:01:48
Jaco Electronics, TSMC Sign 7-Year Capacity Outsourcing Agreement for Advanced Packaging
According to Central News Agency, on November 13, Jaco Electronics (3374.TWO) announced its board approved signing a capacity outsourcing agreement with Taiwan Semiconductor Manufacturing Company (2330.TW) for advanced packaging back-end process collaboration. The partnership runs through December 3