According to MoneyDJ, on November 13, Amazon and Google are advancing next-generation ASIC server PCB specifications with multi-layer and multi-stage HDI (High-Density Interconnect) designs. Amazon's Trainium 4 platform is moving toward 34-layer PCB with 3-stage HDI, while Google's TPU v9 is planned to adopt 6-stage HDI. The shift from traditional high-layer board (HLC) to hybrid thick-layer and multi-stage HDI designs reflects increased technical demands on PCB manufacturers. Taiwan-based PCB makers including Kinwong Electronics, Unimicron Technologies, and Bioswin are positioned to benefit from the expanded ASIC supply chain and rising specifications.

View Source

Disclaimer: This content is for informational purposes only and does not constitute investment advice or encourage the buying or selling of crypto assets. It is intended to provide information about industry developments and is not directly related to the services offered by Gate TR. Although information obtained from third-party sources has been carefully reviewed, Gate TR assumes no responsibility for any errors or omissions. Crypto assets involve high risks and may experience significant price fluctuations. Before making any investment decisions, you should assess your financial situation and risk tolerance, conduct your own research, and make decisions independently.