According to Korean media reports on November 11, AMD and Samsung are collaborating on next-generation embedded processors. The company announced its sixth-generation EPYC Embedded 9006 series on November 10, with the 128-core variant beginning shipment on November 15, and remaining models rolling out by year-end 2026.

The embedded processors integrate Samsung's enterprise-grade memory and storage solutions, including DDR5 RDIMM and MRDIMM memory, PCIe Gen 6-based PM1763 SSDs, and CXL 3.2-based memory modules. Analysts noted the new processors deliver throughput up to 1.8 times higher than the previous generation, targeting industrial applications including semiconductor test automation equipment and enterprise storage systems.

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