According to Guru Club, semiconductor packaging leader ASE announced on November 6 a NTD 123.7 billion investment to expand advanced packaging capacity for artificial intelligence and high-performance computing. The company will establish smart manufacturing lines at Kaohsiung Science and Technology Park, Tainan Park, and other facilities, integrating automation and advanced packaging technologies while deploying solar power systems to support green manufacturing goals.

View Source

Disclaimer: This content is for informational purposes only and does not constitute investment advice or encourage the buying or selling of crypto assets. It is intended to provide information about industry developments and is not directly related to the services offered by Gate TR. Although information obtained from third-party sources has been carefully reviewed, Gate TR assumes no responsibility for any errors or omissions. Crypto assets involve high risks and may experience significant price fluctuations. Before making any investment decisions, you should assess your financial situation and risk tolerance, conduct your own research, and make decisions independently.