According to MoneyDJ, on Nov. 13, Cheng Mei Materials (4960) announced capital expenditure of approximately 1.8 billion yuan through 2028 for advanced semiconductor packaging materials, with 800 million yuan already invested in the first three quarters of 2026. The company is developing packaging-application films derived from existing optical film technology, including wafer dicing and polishing protection tapes, currently undergoing sample validation with Taiwan packaging manufacturers; these materials are expected to generate revenue starting in H2 2027. Separately, high-value product revenue grew from 20% of total in 2025 to 25% in the first three quarters of 2026, with automotive products rising from 7% to 10%; the company targets reaching 40% high-value product mix by Q4 2027.

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