According to MoneyDJ, on November 12, Huabang announced expansions in optical communication module and advanced multilayer printed circuit board (HDI) capacity, citing low-orbit satellite deployment and AI data center growth as key drivers. The expansion is tied to SpaceX's Starlink transition from V2 Mini to V3, which is estimated to increase parts per satellite by approximately 50%. However, critical supply chain components face timing misalignment: 6-inch gallium nitride (GaN) wafers are in severe shortage; advanced PCB production and test equipment face capacity constraints; and new NAND flash memory production is not expected until H2 2027. Additionally, Rocket Lab's Neutron medium-lift rocket, initially planned for launch by year-end, has been postponed to Q1 2027 or later due to manufacturing delays, limiting near-term alternatives to SpaceX's launch capacity.

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