According to industry executives familiar with the matter, on November 6, Nvidia is providing billions of dollars to help MediaTek's subsidiary Powertech expand CoWoS advanced packaging capacity, covering facility space and equipment investments. CoWoS is a critical packaging technology that integrates computing chips and memory, currently supplied primarily by Taiwan Semiconductor Manufacturing Company and widely used in AI chips from Nvidia, AMD, and Broadcom. As CoWoS production capacity tightens amid surging AI chip demand, chipmakers are actively seeking additional supply sources to support their expansion needs.

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