According to Yonhapinfomax, Samsung Electronics Chairman Lee Jae-yong announced on November 12 that the company's advanced semiconductor packaging facility in Asan, South Korea will shift focus toward producing high-bandwidth memory (HBM) chips, positioning the plant as a key AI semiconductor production hub. Lee stated the facility, once used for basic assembly and testing, will become an advanced manufacturing center for cutting-edge HBM production. He added that Samsung plans to actively pursue major projects across the Honam and Yeongnam regions in addition to the Chungcheong initiative.

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