According to ChainCatcher, Samsung Electronics plans to complete its advanced packaging technology 3D Cube-H in early 2027 and launch its first design kit to initiate customer evaluations. The hybrid bonding-based technology enables vertical chip stacking for high-performance AI semiconductors, supporting GPU logic chip stacking or integrating logic chips on HBM memory chips, with a terminal pitch of approximately 6 micrometers compared to 25 micrometers for thermal compression bonding methods.

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