精材's board of directors approved signing a capacity outsourcing agreement with Taiwan Semiconductor Manufacturing Company (TSMC) on 115/11/13, according to a filing with the Taiwan Stock Exchange. The agreement, running from 115/11/13 to 122/12/31, establishes cooperation in advanced packaging back-end processes to deepen the long-term strategic partnership between the two companies. The collaboration responds to strong capacity demand for high-performance computing (HPC) chips driven by rapid adoption of artificial intelligence (AI), HPC, and data center applications, with the advanced packaging technology capacity market showing structural growth.
精材 to Build Production Line at TSMC Central Taiwan Science Park Facility
精材 plans to build production lines at TSMC's Central Taiwan Science Park facility and take responsibility for production-related operations. The company stated it will become a new force in oS module supply within the advanced packaging supply chain. Under TSMC's support, 精材 will invest capital expenditures in production equipment and Automated Material Handling Systems (AMHS) and handle manufacturing and production line operations. The filing identifies TSMC as a major influential investor in 精材.
精材 stated it will combine its extensive and excellent testing and packaging operational experience with TSMC's advanced packaging technology and manufacturing capability support. The two parties will work together to ensure the new production line's technical specifications, quality, and yield meet the strict requirements of TSMC and top global customers.
精材 Plans Phase 1 Production Launch in 118
The production line construction and mass production schedule will proceed according to the planned timeline. The entire project plans to achieve Phase 1 production line mass production in 118, according to the company's filing.
精材 Board Approves NT$15 Billion Convertible Bond Issuance
The board of directors approved issuing NT$15 billion in convertible corporate bonds to support initial capacity construction needs. The filing stated this financial arrangement will address the capital requirements for the production facility buildout.
FAQ
What agreement did 精材's board approve on 115/11/13?
精材's board approved signing a capacity outsourcing agreement with TSMC on 115/11/13. The agreement runs from 115/11/13 to 122/12/31 and establishes cooperation in advanced packaging back-end processes.
When does 精材 plan to start mass production at the new facility?
精材 plans to achieve Phase 1 production line mass production in 118 at the facility located in TSMC's Central Taiwan Science Park, according to the company's regulatory filing.
How will 精材 finance the new production capacity?
精材's board approved issuing NT$15 billion in convertible corporate bonds to support initial capacity construction needs, including investments in production equipment and Automated Material Handling Systems.
