According to Commercial Times and industry supply chain sources, TSMC and other advanced packaging providers are preparing to raise CoWoS prices by 10-20% as production capacity tightens. Lead times for packaging services have extended from 3-6 months to 6-8 months, with chip customers willing to place orders for any confirmed delivery slot without negotiating prices.

The capacity squeeze stems from surging demand across AI GPUs, server CPUs, and custom ASICs, compounded by longer testing cycles that strain both packaging and testing operations. Industry analysts estimate TSMC's CoWoS monthly capacity will target over 200,000 wafers by 2027, driven by facilities in Taiwan and the U.S.

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