According to The Information on November 8, TSMC is evaluating production of next-generation 3D DRAM at the request of Nvidia to address rising AI infrastructure demand, potentially building new fabs or acquiring existing ones. Wistron Electronics chairman Chiao Yu-chun expressed skepticism, stating DRAM manufacturing requires mastering core technology and resolving patent issues; TSMC, if entering the memory market, would not do a half-hearted job.

Chiao also highlighted industry partnerships as a critical challenge, noting TSMC's close collaboration with Samsung, SK Hynix, and Micron. Direct competition with these major partners could complicate the strategy. TSMC declined to comment on the report, reaffirming its focus on foundry services, while Nvidia has not responded.

View Source

Disclaimer: This content is for informational purposes only and does not constitute investment advice or encourage the buying or selling of crypto assets. It is intended to provide information about industry developments and is not directly related to the services offered by Gate TR. Although information obtained from third-party sources has been carefully reviewed, Gate TR assumes no responsibility for any errors or omissions. Crypto assets involve high risks and may experience significant price fluctuations. Before making any investment decisions, you should assess your financial situation and risk tolerance, conduct your own research, and make decisions independently.