According to Benzinga, Micron announced at a recent technical conference a roadmap for next-generation vertical high-bandwidth memory (vHBM) with a 2TB/s bandwidth target and plans to begin mass production in 2028. The architecture directly stacks DRAM on top of processors to shorten data transmission paths, enhancing efficiency for AI inference workloads.

However, the design poses thermal challenges by obstructing processor cooling, potentially limiting its adoption scope. BNP Paribas analyst Karl Ackerman noted vHBM will likely coexist with traditional HBM rather than replace it, as system vendors must balance bandwidth gains against thermal constraints and manufacturing complexity. Micron plans to introduce three generations of vHBM products by 2030.

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